Measurement of LED Junction Temperature Using Thermoreflectance Thermography

摘要：

　　The reliability and optical performance of an LED are dependent on its junction temperature.In this paper,the surface temperature of a chip level conversion LED package was measured using thermoreflectance thermography.The junction-ambient thermal resistance of the same LED device was measured using a thermal transient tester and the junction temperature subsequently calculated from this.Good agreement was obtained between the die surface temperature measured using TRT and the junction calculated from the thermal resistance measured.This work has demonstrated the potentiality of using TRT for directly measuring the junction temperature of LED devices.

关键词： LED Thermal Resistance Thermoreflectance

作者: J.H.L.Ling A.A.O.Tay

作者单位: Temasek Laboratories @NTU Nanyang Technological University Department of Mechanical Engineering National University of Singapore

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1482-1485

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）