Intel Enterprise Server Processor Packaging Challenge and Future Trend

摘要：

　　processor package has played significant role during Intel servers historic path.From the early front side bus(FSB)interconnect with north bridge chipset to the current quick path interconnect(QPI),server package architecture and design have met the challenge at each step.This paper summarized what we have done to implement quad core multi-chip package with compatible platform,develop multi-package socket with compressed Hex pattern,implement air core inductor to support Fully Integrated Voltage Regulator(FIVR)and create the Patch on Interposer(PoINT)technology to meet the product need and still maintain the low cost.At the end,future Intel server challenge and trend is discussed.

关键词： processor package socket FSB PoINT FIVR Hex pattern

作者: Richard Zhao

作者单位: Data Center Group Intel Corporation Hillsboro,Oregon,USA

会议类型: 国际会议

会议名称: The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) ) (第十五届电子封装技术国际会议)

会议地点: 成都

会议语种:英文

页码: 1516-1521

在线出版日期: 2014-08-12（万方平台首次上网日期，不代表论文的发表时间）