Influence of the Socket on Chip-level ESD Testing
This paper introduces a method of IC-level Electrostatic Discharge (ESD) testing and discusses the influence of the socket on Chip-Level ESD testing. During the powered ESD (PESD) testing, welding the chip to the PCB is a necessary process which can be a repetitive process and time consuming. In order to solve this problem, a ball grid array (BGA) test socket is used during the test. The socket is built from copper-clad pogo pin and is pinned in an 8￡8mm array with 121 pins on a 0.65-mm pitch. As the test results suggest, there is little difference between testing with the socket and without. So in this study we take such factors into account as the pan angle range between ESD gun and PCB, the ESD gun, etc.. It is found in this study that the difference value (D-value) percentage between socketed ESD testing and non-socketed ESD testing is within 6.4%, the D-value percentage that the pan angle range of the ESD gun produces is within 5.8%, and the D-value percentage that the ESD GUN produces is within 5.8%. Based on these findings, it is concluded that work efficiency can be greatly improved by using the socket in PESD testing.
Yu Xiao Jiancheng Li Jianfei Wu Yunzhi Kang Jianwei Su
P. O. Box 9010, Xiangtan University, Xiangtan, Hunan 411105, China National University of Defense Technology, Changsha, Hunan 410073, China Freescale Semiconductor Inc., TEDA, TianJin 300457, China
国际会议
Progress in Electromagnetics Research Symposium 2014(2014年电磁学研究新进展学术研讨会)
广州
英文
266-270
2014-08-01（万方平台首次上网日期，不代表论文的发表时间）