Electromagnetic Modeling and Simulation for Packaging Structures with Lossy Conductors
Accurate electromagnetic (EM) analysis for interconnect structures requires to consider the finite conductivity of involved conductors. The conductor loss could be accounted for through an approximate surface impedance when the skin depth of current is small. However, this approximation may not be valid for large skin depth caused by low frequencies or small conductivities. In this work, we treat the lossy conductors as homogeneous dielectric media and use electric field integral equations (EFIEs) to describe the problem. The EFIEs are solved with the method of moments (MoM) in which the Rao-Wilton-Glisson (RWG) and dual basis functions are used to represent the electric and magnetic current densities, respectively. A numerical example is presented to demonstrate the approach.
Y.Q.Zhang G.Z.Yin X.W.Zhang J.Zhang M.S.Tong
Department of Electronic Science and Technology Tongji University, Shanghai, China
国际会议
Progress in Electromagnetics Research Symposium 2014(2014年电磁学研究新进展学术研讨会)
广州
英文
2252-2255
2014-08-01（万方平台首次上网日期，不代表论文的发表时间）