THERMAL PERFORMANCE OF HIGH-EFFICIENCY HEAT DISSIPATION DEVICE USING VAPOR CHAMBER TYPE HEAT PIPE FOR SHIPS AND OFFSHORE PLANTS

摘要：

　　High-power light emitting diodes (LEDs), a strong candidate for the next generation illumination applications, are of interest.Because of the LEDs have many advantages such power saving long life compared with traditional incandescent bulb and they do not contain filament.Especially, it has attracted the attention of the shipbuilding industries.But there are few problems that are caused by heat generation in the LED package, such as wire breakage, yellowing of epoxy resin, lifted chip caused by reflow of thermal paste chip attach and interfacial separation between LED package and silicon resin.In order to solve these problems, we use vapor chamber type heat pipe.Optimal quantity of state was R-141b 35% charging ratio.Experimental result, LED chip temperature were maintained below 100.0℃.This study is to evaluate thermal characteristics of LED indoor lighting system using vapor chamber type heat pipe for ship and offshore plants.

关键词： High-power LED vapor chamber type heat pipe ship and offshore plant

作者: Jun Heo Jong-Soo Kim Soo-Jung Ha

作者单位: Department of Refrigeration and Air-Conditioning Engineering, Pukyong National University Pukyong National University, Busan County, 608-739, Korea

会议类型: 国际会议

会议名称: The 11th International Heat Pipe Symposium(第十一届国际热管研讨会)

会议地点: 北京

会议语种:英文

页码: 114-117

在线出版日期: 2013-06-09（万方平台首次上网日期，不代表论文的发表时间）