A NOVEL INTEGRAL WICK STRUCTURE FOR ULTRA-THIN FLAT HEAT PIPES
Microelectronics has become the very key element for todays high tech industry due to the fact that it is smaller, thinner, lighter and more portable.Heat pipe, as one of the many kinds to help managing the thermal environment of the devices, also requires to be downsized.Particularly for the areas where a spatial limitation is encountered and for the device that requires a large surface area to volume ratio to capture as much power density as it possibly can, the ultra-thin flat heat pipe comes to consideration due to its well defimed geometry and the ability in reducing thermal spreading resistance.However, common deficiencies are always found in conventional flat heat pipes, with clogged vapour space and low capillary limit.This paper is aimed to incorporate a novel integral wick structure for ultra-thin flat heat pipesin dealing with the above issues.The wicks should allow enough space for vapour flow passage, be maximised and unclogged;to optimisethe individual performanceoffered by evaporator, adiabatic and condenser;and to produce excellent capillary pumping force even under anti-gravity condition.Significantly, thin film evaporation which associates with sintered wick structure has been thoroughly investigated and in order to validate the proposed wick, mathematical modelling in terms of wick porosity, permeability and capillarity will be presented.
Flat heat pipe composite wicks sintering groove thin film evaporation capillary limit
Qian Wang Yuying Yan
HVACR & Heat Transfer Group Faculty of Engineering, University of Nottingham, UK
国际会议
The 11th International Heat Pipe Symposium(第十一届国际热管研讨会)
北京
英文
138-145
2013-06-09（万方平台首次上网日期，不代表论文的发表时间）