Crosstalk Modeling and Analysis of Through-Silicon-Via Connection in 3D Integration

摘要：

　　For the wider bandwidth and the smaller form factor,high-speed I/O channel design in three-dimensional integrated circuit(3D IC)becomes more important.Through-Silicon-Via(TSV)is regarded as a critical component in 3D integration that extends Moores Law.In TSV based 3D-IC systems,a significant design consideration is the coupling noise between TSVs.This paper focuses on the TSV crosstalk analysis under high speed operations using a 3D electromagnetic field solver and a SPICE simulator.Effects of the TSV radius,insulator thickness,and TSV pitch are investigated in details.In addition,the crosstalk performance of different TSV bus configurations is also evaluated and compared,which is one important consideration in high speed interconnection systems.

作者: Xiang He Wensong Wang Qunsheng Cao

作者单位: Nanjing University of Aeronautics and Astronautics,China

会议类型: 国际会议

会议名称: Progress in Electromagnetics Research Symposium 2013(2013年电磁学研究新进展学术研讨会)

会议地点: 台北

会议语种:英文

页码: 857-861

在线出版日期: 2013-03-01（万方平台首次上网日期，不代表论文的发表时间）