The Research on Micro Electronic-Magnetic Forming of Sheet Metal

摘要：

　　Micro channel of T2 copper were molding through electronic-magnetic forming experiments.Laser scanning confocal microscope and contourgraph were used to measure the section profile and sheet thickness.The effects of voltage,shape of channel and discharge cycles on laws of metal flow were studied.Results showed that forming depth of micro channel and thinning of sheet thickness increased as the increasing of the voltage.Mold-filling capacity of components formed by two molds with different structures had been increased when the voltage was increased.Mold with semicircle structure facilitate the material flow and the forming depth of parts was relative large.Semicircle structure was better than taper structure in mold-filling capacity.A number of small pulse discharges can improve the forming quality and deformation,but local thinning in sheet metal leads to non-uniform distribution of thickness.

关键词： electromagnetic forming array microstructure foil board micro forming micro channel

作者: ZHAO Qing-juan GUO Bin WANG Chun-ju SHAN De-bin YU Hai-ping LI Chun-feng

作者单位: School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China

会议类型: 国际会议

会议名称: The 7th International Conference on Electromagnetic Processing of Materials(第七届冶金与材料电磁过程国际大会)

会议地点: 北京

会议语种:英文

页码: 1-6

在线出版日期: 2012-10-22（万方平台首次上网日期，不代表论文的发表时间）