On the Addition Effects and Bumps of Low Wilver Lead Free Solder SAC3007 by the Simulation Board Joining

摘要：

　　Bumps are still encountered in the application of lead-free solder in wave soldering.SAC0307, SAC0307X, SAC305 and SAC305X sold ers were studied to reveal the characteristics of cur rently facing problems.Similar qualifies on the four alloys could be found with the defects by analyzing the wave soldered simulation PCB under the same conditions.Finally, the good soldering rdiability of the low Ag lead-free solder is studied under ther mal fatigue and dropping shock conditions.

关键词： Thermal fatigue wave soldering Low silver defects

作者: Chun-yan WANG Yu-peng ZHANG

作者单位: School of Electro-mechanics,Guangzhou Vocational College of Technology & Business,Guangzhou,511442,C Guangzhou Research Institute of Non-ferrous Metals,Guangzhou 510650,China

会议类型: 国际会议

会议名称: The 12th China-Russia Symposium on Advanced Materials and Technologies(第十二届中俄双边新材料新工艺国际会议)

会议地点: 昆明

会议语种:英文

页码: 43-46

在线出版日期: 2013-11-19（万方平台首次上网日期，不代表论文的发表时间）