Review of AuSn20 Solders Preparation Technology

摘要：

　　With the development of minia turization and lead free of electronic products, high demand is put forward about solder.AuSn20 lead free solder is widely used in high reliable hermetic package and chip welding due to excellent mechani cal property.This paper described the proper ties and preparation technology of AuSn20 solder, point ed out the disadvantages of the conventional drawing and rolling process, casting process and laminose composite process of cold rolling, put out improve ment of study method and the preparation technolo.gy, investigate and develop the new forming technol ogy for preparing AuSn20 low temperature eutectic solder, will achieve the solid basis for the large scale production of this material.

关键词： AuSn20 solder preparation technology lead-free solidification microstructure electronic products

作者: Ming Xie Jie-Qiong Hu Ji-Ming Zhang You-Cai Yang Man-Men Liu Yong-Tai Chen Sai-Bei Wang Song Wang Yun-Feng Yang

作者单位: State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metals,Kunming 650106,China

会议类型: 国际会议

会议名称: The 12th China-Russia Symposium on Advanced Materials and Technologies(第十二届中俄双边新材料新工艺国际会议)

会议地点: 昆明

会议语种:英文

页码: 227-230

在线出版日期: 2013-11-19（万方平台首次上网日期，不代表论文的发表时间）