Influence of the Bilayer on Bonding Diamond and Copper Components with AlNi Micro/nano Multilayers

摘要：

　　In this paper, we focus on the need for the heat sink (diamond type) and LED chip join ing with high thermal conductivity.AlNi nano/mi cro-multilayers were fabricated and evaluated to satisfy the need to bonding copper and diamond for the first time.From the thermal analysis and micro structure observation, it is fould that the bilayer (the thickness of one alternative sputtering period of aluminium and nickel)of the mulilayers could influ ence the heat release of propagation reaction and help control the bonding process with steady.The influence of the Vanadium and the electromagnetic effect on the structures of the muitilyers were also discussed, which has relation with the bilayer ei ther.The quality of the joint by nano-mnitilayer bonding is better than that of the silver glue bond.

关键词： Nano-multilayers Al-Ni self-propagation reaction bond intermetallic

作者: Y.P.Zhang J.L.Yi Z.Y.Luo L.Xu H.X.Chen M.J.Dai

作者单位: E.O.Paton Chinese-Ukrainian Institute of Welding,Guangzhou Research Institute of Non-ferrous Metals,Guangzhou,510651,China

会议类型: 国际会议

会议名称: The 12th China-Russia Symposium on Advanced Materials and Technologies(第十二届中俄双边新材料新工艺国际会议)

会议地点: 昆明

会议语种:英文

页码: 242-246

在线出版日期: 2013-11-19（万方平台首次上网日期，不代表论文的发表时间）