The Microstructure and Mechanical Properties of High Reliability SAC305X Solder

摘要：

　　This paper focuses on the influence of the addition of micro Ni and mischmetal on the wet ting power, tensile strength and elongation of SnAgCu305 lead free solder.The results show that adding appropriate Ni, Re into the solder will im prove its comprehensive properties and welding reli ability.When the content of Ni is 0.02%, Re is 0.05 %, the solder presents the best property.

关键词： SAC305 Wetting Power Tensile Strength Reliability

作者: L.Xu Y.P.Zhang J.L.Yi K.Wang

作者单位: Guangdong General Research Institute of Industrial Technology(Guangzhou Research Institute of Nonferrous Metals),Guangzhou 510650,China

会议类型: 国际会议

会议名称: The 12th China-Russia Symposium on Advanced Materials and Technologies(第十二届中俄双边新材料新工艺国际会议)

会议地点: 昆明

会议语种:英文

页码: 261-264

在线出版日期: 2013-11-19（万方平台首次上网日期，不代表论文的发表时间）