Microstructure and Thermophysical Properties of SiC/Al Composites mixed with Diamond
The thermophysical properties of the SiC/Al composites mixed with diamond (hereinafter SiC-Dia/Al) was studied through theoretical calcu lation and experiments.The thermal conductivity and the thermal expansion coefficient of the SiC Dia/Al are calculated by differential effective medi um (DEM) theoretical model and extended Turner model respectively.The microstructure of the SiC Dia/Al shows that the combination between SiC par ticles and Al is closer, while that between diamond particles and Ai is not dose.The experimental re suits of the thermophysical properties of the SiC Dia/Al are consistent with the calculated ones.The calculation results show that when the volume ratio of the diamond particles to the SiC particles is 3∶7 the thermal conductivity and the thermal expansion coefficient can improve 39 % and 30 % comparing to SiC/Al composites, respectively.In other words, adding a small amount of the diamond particles, the thermophysical properties of the composites can be improved effectively, while the cost increasing a lit fie.
SiC/Al composites mixed with diamond thermal conductivity thermal expansion coefficient microstructure
Hong Guo Yuanyuan Han Ximin Zhang Fazhang Yin Chengchang Jia Jun Xu
Beijing General Research Institute for Non-ferrous Metals National Engineering Technology Research C Beijing General Research Institute for Non-ferrous Metals National Engineering Technology Research C University of Science & Technology Beijing School of Materials and Engineering
国际会议
The 12th China-Russia Symposium on Advanced Materials and Technologies(第十二届中俄双边新材料新工艺国际会议)
昆明
英文
431-434
2013-11-19（万方平台首次上网日期，不代表论文的发表时间）