Characterization of Al/Ni Nanoscale Multilayers Used for Transient-Liquid-phase Bonding of Copper and Al2 O3 Ceramic

摘要：

　　A series of Al-Ni reactive multilay er with different modulation periods were fabrica ted, and transient-liquid-phase (TLP) bonding of copper and Al2O3 ceramic was carried out by u sing the multilayers.The microstructure of the as deposited foils and cermet joint were investigated.The reaction behavior of Al/Ni multilayers was characterized by means of DSC and X-ray diffrac tion.The results showed the application of Al/Ni nano-multilayers decreased the joining temperature of the copper and Al2O3 ceramic, meanwhile im proved the quality of the joint.

关键词： Al-Ni nano-multilayers TLP -bonding interface Al2O3 ceramic

作者: J.L.Yi Y.P.Zhang H.C.Hu X.X.Wang H.X.Chen M.J.Dai

作者单位: E.O.Paton Chinese-Ukrainian Institute of Welding,Guangzhou Research Institute of Non-ferrous Metals, E.O.Paton Chinese-Ukrainian Institute of Welding,Guangzhou Research Institute of Non-ferrous Metals,

会议类型: 国际会议

会议名称: The 12th China-Russia Symposium on Advanced Materials and Technologies(第十二届中俄双边新材料新工艺国际会议)

会议地点: 昆明

会议语种:英文

页码: 455-458

在线出版日期: 2013-11-19（万方平台首次上网日期，不代表论文的发表时间）