Properties and Microstructure of Cu/Diamond Composites Prepared Through Spark Plasma Sintering

摘要：

　　Cu/diamond composites have been considered as a next generation of thermal manage ment material for dectronic packages and heat sinks applications.In this paper, Cu/diamond composites with different volume fraction of diamond were suc cessfully prepared through spark plasma sintering (SPS), and the microstructure and thermal proper ties of the composites were examined.The sintering temperature and volume fraction (50 %, 60 % and 70 %) of diamond were changed to investigate their effects on the relative density, homogeneity of the microstructure and thermal conductivity of the com posites.The results show, the relative density, hom ogeneity of the microstructure and thermal conduc tivity of the composites increases with decreasing of diamond volume fraction; the relative density and thermal conductivity of the composites increases with the increasing of sintering temperature.The thermal conductivity of the composites is a result of the com bination of the volume fraction of diamond, the homogeneity and relative density of the composites.

关键词： Cu/diamond composites spark plasma sintering relative density thermal conductivity

作者: Jingmei Tao XinKun Zhu Weiwei Tian Peng Yang Hao Yang

作者单位: Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming,Yunnan,China 650093

会议类型: 国际会议

会议名称: The 12th China-Russia Symposium on Advanced Materials and Technologies(第十二届中俄双边新材料新工艺国际会议)

会议地点: 昆明

会议语种:英文

页码: 474-478

在线出版日期: 2013-11-19（万方平台首次上网日期，不代表论文的发表时间）