Characteristic analysis of thermal aging of tungsten delay composition
Changes of delay time and thermal conductivity of tungsten delay composition with thermal aging time are discussed in this paper.Through a numerical regression, the relationship of the delay time and thermal conductivity can be used to achieve the fast calculation of the delay time during aging.The main conclusions are as follows:the delay time of tungsten delay composition changed, meanwhile, the thermal conductivity increased.To the tungsten delay composition which contains 30% tungsten, a quadratic equation can well coincide with the relationship of delay time and thermal conductivity during aging.
tungsten delay composition accelerated aging delay time thermal conductivity numerical simulation
LEI Lei ZHU Shunguan LI Yan WEI Jingshu LI Xueping
Yahua Group Mianyang Industry,Xinqiao Town,Mianyang,Sichuan 621007,CN NUST,No.200,Xiao Lingwei Street,XuanWu District,Nanjing,Jiangsu 210094,CN
国际会议
成都
英文
249-252
2013-09-24(万方平台首次上网日期,不代表论文的发表时间)