Anti-electrostatic damage characteristic of micro-semiconductor bridge
Aimed at the problems that the micro-semiconductor bridge damage in strong electrostatic voltage leads to early explosion、 mistaken explosion and reduced reliability of semiconductor bridge EED, the paper study bridge damage and resistance change in different strength of the electrostatic voltage, analyse the relationship between electrostatic voltage strength and damage area of bridge as well as changes in electrical resistance, and apply antistatic capacitance to do antistatic reinforcement and performance experiments for the miniature semiconductor bridge.The experimental results show that, after shunted a capacitance, the semiconductor bridge makes antistatic ability enhance greatly, the bridge and explosive have no damage, but fire voltage increases and fire time slows down while capacitance increases.
Semiconductor Bridge Eiectrostatic discharge Initiator
LI Liming YIN Guofu REN Wei LI Fang
National Key Laboratory of Applied Physics and Chemistry,Shanxi Applied and Chemistry Research Institute,Xi an,710061
国际会议
成都
英文
564-568
2013-09-24(万方平台首次上网日期,不代表论文的发表时间)