Effect of microstructure of Mo-Cu alloy on the thermal expansion coefficient

摘要：

　　Mo-Cu alloy with high density can be fabricated at lower sintering temperature by high-energy ball-milling mechanical-alloying method and adding activation element.The rule of change of microstructure and its effect on the thermal expansion coefficient are studied.It is found that the holes in the Mo-Cu alloy sintered at lower temperature disappear, and Mo and Cu distribute uniformly.The Mo particles are fine-grained, and distribute uniformly in the Cu particles using the mechanical-alloying method.The change of thermal expansion coefficient with temperature is in accordance with the effect of adding activation element.There is a minor inflexion in the thermal expansion coefficient curve at 500℃.The change of thermal expansion coefficient with temperature is the same as 95% Al2O3 sealing material.Thus, the thermal property between Mo-Cu alloy and 95% Al2O3 match well.

关键词： Mo-Cu alloy mechanical alloying microstructure thermal expansion coefficient

作者: Zengfeng Li Haiyan Liu Aijun Li Hanliang Zhang Yuanping Huang Ying Shi

作者单位: State key Laboratory of Porous Metal Materials, Northwest Institute for Nonferrous Metal Research, Xian China

会议类型: 国际会议

会议名称: The Eighth China National Conference on Functional Materials and Applications(第八届中国功能材料及其应用学术会议)

会议地点: 哈尔滨

会议语种:英文

页码: 67-71

在线出版日期: 2013-08-23（万方平台首次上网日期，不代表论文的发表时间）