Effects of Particle Size on Microstructures and Properties of Si/Al Composites

摘要：

　　Si/Al composites with different Si particle sizes were fabricated using spark plasma sintering process for electronic packaging.The density, thermal conductivity, coefficient of thermal expansion and flexural strength of the composites were investigated.Effect of Si particle size on structure and properties of the Si/Al composites were studied.The results showed that the Si/Al composites synthesized by spark plasma sintering were composed of Si and Al.Al was uniformly distributed among the Si phase, leading to a high thermal conductivity (>120 W/m.k).The relative density of the Si/Al composites decreased with increasing Si particle size.Small Si particle size produced small grains, leading to a low coefficient of thermal expansion and a high strength.There is an optimal matching among the thermal conductivity, coefficient of thermal expansion and flexural strength when the Si particle size was 44 um.

关键词： Spark plasma sintering Si/Al composites Thermal conductivity Coefficient of thermal expansion Flexural strength

作者: Wei-chen Zhai Zhao-hui Zhang Fu-chi Wang Shu-kui Li

作者单位: School of Material Science and Engineering, Beijing Institute of technology, Beijing 100081, China School of Material Science and Engineering, Beijing Institute of technology, Beijing 100081, China;

会议类型: 国际会议

会议名称: The Eighth China National Conference on Functional Materials and Applications(第八届中国功能材料及其应用学术会议)

会议地点: 哈尔滨

会议语种:英文

页码: 361-365

在线出版日期: 2013-08-23（万方平台首次上网日期，不代表论文的发表时间）