Research progress of diamond/Al composites

摘要：

　　Due to the good physical properties of diamond, diamond/Al composites as a new generation electronic packaging material receive more and more attention.It is one of the greatest potential for the development of packaging materials.The paper on the diamond/A1 composite materials research at home and abroad was summarized in detail.

关键词： diamond/Al composites high thermal conductivity

作者: Yongzheng Liu

作者单位: Beijing Insistute of Aeronautical Materials, Science and Technology on Advanced Composites Laboratory, China

会议类型: 国际会议

会议名称: The Eighth China National Conference on Functional Materials and Applications(第八届中国功能材料及其应用学术会议)

会议地点: 哈尔滨

会议语种:英文

页码: 379-383

在线出版日期: 2013-08-23（万方平台首次上网日期，不代表论文的发表时间）