Bond Mechanics and Failure Mode of Conductive Silver Adhesive for Transducer
In this paper, a novel conductive silver adhesive (ECA) for transducer is prepared to bond piezoelectric patch and the aluminum substrate.X-ray photoelectron spectroscopy (XPS) is used to study the fracture elements in order to analyze bond mechanics, fracture morphology is observation by scanning electron microscopy (SEM).The result of test and analysis shows ECA with sliane coupling agent have both physical and chemical bonding and the fracture type is cohesive failure.However the ECA without sliane coupling agent only has physical bonding and fracture type is mixed failure.
Conductive Silver Adhesive (ECA) bond mechanics failure mode
Chun-ying Wang Rui Zhang
Condensed Matter Science and Technology Institute, Harbin Institute of Technology, Harbin 150001, China
国际会议
The Eighth China National Conference on Functional Materials and Applications(第八届中国功能材料及其应用学术会议)
哈尔滨
英文
837-844
2013-08-23（万方平台首次上网日期，不代表论文的发表时间）