Aluminum Ingot Clamping Process Dynamics Modeling and Analysis Based on The Aluminum Ingot Flip Device

摘要：

　　The problems of dropping ingot and locking ingot that there are when the aluminum ingot flip Device is working were analyzed.The kinematical analysis and dynamic analysis on aluminum ingot clamping process were carried out.The relationship between the working reliability of flip device and the aluminum ingot pose before the aluminum ingot accessing flip device was obtained.The constraint conditions of aluminum ingot accessing flip device were given.This paper provided key technical parameters to the research and development of aluminum ingot pose self-tuning device.

关键词： Flip Device Kinematics Analysis Dynamics Analysis Constraint Conditions

作者: Li Jian Hua Li Zhen Wei Zhao Rong

作者单位: School of Mechanical & Electronical Engineering of Lanzhou University of Technology(The ministry of the Forth Drilling Company of ZPEB

会议类型: 国际会议

会议名称: 2013 International Symposium on Assembly and Manufacturing(2013装配与制造国际专题会议)

会议地点: 西安

会议语种:英文

页码: 77-80

在线出版日期: 2013-07-01（万方平台首次上网日期，不代表论文的发表时间）