Characterizing the Placement Accuracy of a Handling Unit Used for Assembling 3D Circuit Carriers

摘要：

　　The assembly process of electronic components on three-dimensional circuit carriers increases the requirements on placement machines decisively.Decreased component packages and termination sizes require a precise placement process on 3D substrates with complex geometric structures.For characterizing the quality of this three-dimensional placement process,an evaluation methodology was developed.Therefore 3D test specimens were designed.The placement equipment,that has to be investigated,places components onto these specimens.Afterwards the component positions are analyzed by an optical coordinate measurement machine (CMM) and the placement error is calculated.This paper gives an overview of Molded Interconnect Technology (MID) and introduces the functionality of the investigated placement equipment,an automated multi axis handling unit for assembling 3D-MID.Focus is the presentation of the developed method for characterizing placement equipment used for 3D assembling of MID.Thedesign of the test specimens,the procedure of component placement and of measuring the component position areexplained.The results of characterizing the automated multi axis handling unit are shown.Influences and effects on the placement quality will be discussed.The developed method provides equipment manufacturers and users with a methodology to characterize,specify,document and verify the equipment’s placement accuracy.

关键词： Placement Accuracy Molded Interconnect Device Surface Mounted Device

作者: Michael Pfeffer Joerg Franke

作者单位: Friedrich-Alexander-University of Erlangen-Nuremberg Institute for Factory Automation and Production Systems(FAPS)Fuerther Str. 246b Nuremberg, 90429, Germany

会议类型: 国际会议

会议名称: 2013 International Symposium on Assembly and Manufacturing(2013装配与制造国际专题会议)

会议地点: 西安

会议语种:英文

页码: 112-115

在线出版日期: 2013-07-01（万方平台首次上网日期，不代表论文的发表时间）