Fabrication and Characterization of Pt Archimedean-spiral Interdigitated Microelectrodes with Containing Trenches
In this paper a Pt Archimedean-spiral interdigitated microelectrode with containing trenches was put forward,fabricated and characterized.Pt film with thickness 300nm was deposited by radio frequency (RF) magnetron sputtering on a Ti deposited n(100) Si substrate.On this Pt coated Si substrate a passivation layer of Si3N4 film with thickness 350nm was coated by plasma-enhanced chemi-cal deposition (PECVD).The conventional photolithographic technique was used to pattern the Archimedean-spiral interdigitated microelectrodes with containing trenches,the contact tracks and the bond pads.Scanning electron microscopy (SEM) images along with filtration,line edge detection and fit operators of Mat-Lab software were employed to characterize the quality of Pt interdigitated micro-electrodes.Cyclic voltammetry was performed on a CHI660D electrochemical workstation and the results indicated the critical dimension (CD) of Pt Archime-dean-spiral interdigitated microelectrode with containing trenches was within sub-micrometer range and the microelectrode can be used as the key sensing device in electrochemistry,biology,medicine and environmental monitoring.
Archimedean-spiral Interdigitated microelectrode Containing trenches Finger-end effect Sharp angle transition
Weixuan Jing Lujia Chen Fan Zhou Zhuangde Jiang Lingling Niu Bing Wang Han Qi
State Key Laboratory for Manufacturing Systems Engineering Xian Jiaotong University 710049, Xian, China
国际会议
2013 International Symposium on Assembly and Manufacturing(2013装配与制造国际专题会议)
西安
英文
128-130
2013-07-01（万方平台首次上网日期，不代表论文的发表时间）