Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Grinding Wheel
In this paper,experiments are conducted to study the characters of Ultrasonic Assisted Grinding(UAG) and Conventional Grinding(CG),diamond grinding wheel is used in experiments,grinding forces and surface roughness are measured in both UAG and CG.The effects of different parameters on grinding force,surface roughness and force ratio are discussed.The results show that the grinding force and surface roughness in UAG is smaller than those in CG.The force ratio in UAG is lower than that in CG,which reveals that the grinding wheel has a good wear-resistant property in UAG process.
Ultrasonic assisted grinding SiC Grinding force Surface roughness
Lifei Liu Feihu Zhang Chunhui Li Jiang Chen Minhui Liu
School of Mechanical and Electrical Engineering,Harbin Institute of Technology,West Dazhi Street 92,Harbin,China,150001
国际会议
杭州
英文
234-239
2013-09-23(万方平台首次上网日期,不代表论文的发表时间)