会议专题

Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Grinding Wheel

  In this paper,experiments are conducted to study the characters of Ultrasonic Assisted Grinding(UAG) and Conventional Grinding(CG),diamond grinding wheel is used in experiments,grinding forces and surface roughness are measured in both UAG and CG.The effects of different parameters on grinding force,surface roughness and force ratio are discussed.The results show that the grinding force and surface roughness in UAG is smaller than those in CG.The force ratio in UAG is lower than that in CG,which reveals that the grinding wheel has a good wear-resistant property in UAG process.

Ultrasonic assisted grinding SiC Grinding force Surface roughness

Lifei Liu Feihu Zhang Chunhui Li Jiang Chen Minhui Liu

School of Mechanical and Electrical Engineering,Harbin Institute of Technology,West Dazhi Street 92,Harbin,China,150001

国际会议

16th International Symposium on Advances in Abrasive Technology(ISAAT2013) in conjunction withthe 17th Chinese Conference of Abrasive Technology(CCAT2013)(第16届国际磨粒技术会议暨第17届全国磨粒技术学术会议)(

杭州

英文

234-239

2013-09-23(万方平台首次上网日期,不代表论文的发表时间)