A study on the analysis of influential factors for 300mm wafer final polishing

摘要：

　　In recent years,developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon.However,for many companies,it is hard to produce 400mm or 450mm wafers,because of excesive funds for exchange the equipments.Therefore,it is necessary to investigate 300mm wafer to obtain a better efficiency and a good property rate.Wafer final Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers.This research investigated the surface characteristics and optimum condition of applied pressure,polishing speed and slurry-mixed ratio to achieve the optimum condition of wafer final polishing by Taguchi method.By using optimum condition,it helps to achive an ultra precision mirror like surface.

关键词： Si-wafer Wafer final polishing Surface roughness Optimum condition Taguchi method

作者: Woong-Kirl Choi Eun-Sang Lee Hon-Zong Choi Nam-Kyung Kim

作者单位: School of Mechanical Engineering,Inha Univ.,253 Yonghyun-Dong,Nam-Gu,Incheon,Korea Department of Mechanical Engineering,Inha Univ.,253 Yonghyun-Dong,Nam-Gu,Incheon,Korea Korea Institute of Industrial Technology,1271-18,Sa3Dong,Sangrok-Gu,Gyeonggi-do,Korea Department of Automotive Engineering,Gyeongnam National Univ.of Science and Technology,150 Chilam-Do

会议类型: 国际会议

会议名称: 16th International Symposium on Advances in Abrasive Technology(ISAAT2013) in conjunction withthe 17th Chinese Conference of Abrasive Technology(CCAT2013)(第16届国际磨粒技术会议暨第17届全国磨粒技术学术会议)(

会议地点: 杭州

会议语种:英文

页码: 438-443

在线出版日期: 2013-09-23（万方平台首次上网日期，不代表论文的发表时间）