Development of a Measuring Equipment for Silicon Wafer Warp
Larger diameter wafers are used to decrease the cost of IC manufacturing and the wafer thickness is decreasing for form factor and thermal power dissipation considerations.The larger wafer requires a large scanning area to inspect the warp,and warp measurement of large and thin silicon wafers is greatly affected by the gravity-induced deflection.In this paper the gravity-induced deflection was calculated using finite element method by supporting the wafer horizontally with three steel balls.A laser displacement sensor based on triangulation principle was used to measure the warp and an air bearing stage was developed to achieve high straightness.The shape of the wafer was obtained using the silicon wafer warp measuring equipment.
Large and thin silicon wafer Gravity-induced deflection Warp measuring equipment FEM Air bearing stage
Haijun Liu Renke Kang Shang Gao Ping Zhou Yu Tong Dongming Guo
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education,Dalian University of Technology,Dalian 116024,P.R.China
国际会议
杭州
英文
561-565
2013-09-23（万方平台首次上网日期，不代表论文的发表时间）