Experimental Measurements for Mechanical and Electrical Conductive Properties of CNT Bundles

摘要：

　　With the miniaturization and multifunction trend in consumer electronics and other numerous applications,the characteristic sizes of chips,components and devices become smaller and smaller while the power dissipation and the associated heat flux density increase constantly.Carbon nanotube (CNT) has become a promising material due to its mechanical and conductive properties.In this paper,the CNT bundles on silicon chip have been experimentally investigated with respect to both the mechanical behavior under loading and the electrical conductivity as flip-chip interconnects.

作者: Y.ZHANG Y.-J.ZHOU J.-Y.FAN J.LIU

作者单位: Key Laboratory of Advanced Display and System Applications, Ministry of Education & SMIT Center, Sch Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University,Shanghai 200072, China Key Laboratory of Advanced Display and System Applications, Ministry of Education & SMIT Center, Sch

会议类型: 国际会议

会议名称: Sixth International Conference on Nonlinear Mechanics(第六届国际非线性力学会议)(ICNM-VI)

会议地点: 上海

会议语种:英文

页码: 454-457

在线出版日期: 2013-08-01（万方平台首次上网日期，不代表论文的发表时间）