Mechanics of reversible adhesion
By pressure-controlled surface contact area,reversible adhesion can be achieved with strengths tunable by 3 orders of magnitude.This capability facilitates robust transfer printing of active materials and devices onto any surface for the development of stretchable and/or curvilinear electronics.The most important parameter in designing the surfaces of stamps for this process is the height of the microtips relief: tall microtips may fail to pick up electronics from their growth substrate,while short ones may fail to print electronics on the receiver substrate.Models of fracture mechanics are developed to determine the range of the microtip height for successful transfer printing.Analytical expressions for the minimum and maximum heights are obtained,which are very useful for stamp design.
dry adhesion elastomeric stamp flexible electronics microelectromechanical systems
Jian Wu Keh-Chih Hwang Yonggang Huang John A.Rogers
AML,Department of Engineering Mechanics,Tsinghua Universitry,Beijing 100084,China Department of Civil and Environmental Engineering and Department of Mechanical Engineering,Northwest 3Department of Materials Science and Engineering,Beckman Institute,and Seitz Materials Research Labo
国际会议
北京
英文
1-1
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）