会议专题

Residual stress analysis of a thermal barrier coating system

finite element analysis thermal barrier coating residual stress

H.J.Shin B.J.Kim C.S.Seok J.M.Koo B.S.Lim M.K.Kim

School of Mechanical Engineering,Sungkyunkwan University,Suwon-Si,South Korea School of Mechanical Engineering,Dongyang Mirae University,Seoul,South Korea

国际会议

第13届国际断裂大会(ICF2013)

北京

英文

1-1

2013-06-16(万方平台首次上网日期,不代表论文的发表时间)