Analysis of a singular stress field near the edge of joint using molecular dynamics
Recently,thin films with a nanometer thickness been used in electronic parts.When the size of material reduces to a nanometer,the area to volume ratio increases,then the mechanical property of surface or interface influences on mechanical behavior of bulk.Hence,it is very important to investigate the mechanical properties of interface and surface for the stress analysis in nano-scale materials.In the present paper,stress distribution near a wedge composed of several different materials is investigated using molecular dynamics (MD).The model used in the present analysis is a bonded joint of copper and gold,which is used in electronic parts.In the analysis,temperature of the model increases up to 5K for relaxation of the structure.A tensile load is applied in a radial direction along the outer surface of the model.The atomic stress distributions near the wedge tip in the joints and the angular function for the stress,which is derived from the theory of anisotropic elasticity,are compared.It can be found from the comparison that interface stress influences on the distribution of singular stress in the bulk and the intensity of singularity at the wedge tip.
Molecular dynamics Singular stress Interface Joint Stroh formalism
Hideo Koguchi Nobuyasu Suzuki
Department of Mechanical Engineering,Nagaoka University of Technology,940-2188,Japan
国际会议
北京
英文
1-11
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）