Damage evolution of a thin-film/substrate system under thermal-mechanical loads
damage evolution thin film thermal-mechanical phase-field method
Ze Jing Youhe Zhou
Department of Mechanics and Engineering Science,Lanzhou University,Lanzhou 730000,China
国际会议
北京
英文
1-1
2013-06-16(万方平台首次上网日期,不代表论文的发表时间)