The thermal effect of anti-plane crack in a functionally graded piezoelectric strip under electric shock

摘要：

　　The thermal effect of mode III crack in a functionally graded strip under the electric shock is investigated.This fracture analysis can be expressed through the superposition of two problem solutions.The first solution is the dynamic behaviors of a functionally graded piezoelectric material with central crack subjected to the electric shock.

关键词： Anti-plane crack Functionally graded piezoelectric materials Electric shock Thermal effect

作者: Xing Li Yongyi Long Pengpeng Shi

作者单位: School of Mathematics and Computer Science,Ningxia University,750021,China

会议类型: 国际会议

会议名称: 第13届国际断裂大会(ICF2013)

会议地点: 北京

会议语种:英文

页码: 1-10

在线出版日期: 2013-06-16（万方平台首次上网日期，不代表论文的发表时间）