Impact failure analysis of solder joint based on explicit dynamic method

摘要：

　　The component-level high-speed shear test is an important means of studying the reliability of Sn-Ag-Cu solder joint in electronic package caused by impact loading. Experimental studies show that the failure of solder joint structure will transfer from the ductile damage of solders to the brittle fracture of interfacial intermetallic compounds (IMC) with the increase of impact velocity; at the same time, the shape of load-displacement response curve will also have a significant change.

关键词： explicit dynamics impact solder joint cohesive zone model electronic package

作者: Yangjian Xu Chaochao Jin Lihua Liang Xiaogui Wang

作者单位: Department of solid mechanics,College of mechanical engineering,Zhejiang University of Technology,Hangzhou 310014,China

会议类型: 国际会议

会议名称: 第13届国际断裂大会(ICF2013)

会议地点: 北京

会议语种:英文

页码: 1-1

在线出版日期: 2013-06-16（万方平台首次上网日期，不代表论文的发表时间）