Fracture on infrared MEMS packaging

摘要：

　　Infrared MEMS device packaging was very different from general device. We proposed a new hybrid wafer level vacuum packaging method for the infrared MEMS package, the main structure was three-layer structure, like a sandwich, using the 80Au-20Sn solder bonding to connection three structure layers in MEMS Vacuum bonding equipment. The substrate layer bearing and processing chip, micro-fabrication on this layer. The middle hollow layer was improved the package space and increase the life of the chip.

关键词： infrared MEMS hybrid wafer level vacuum packaging 80Au-20Sn solder fracture thermal stress

作者: Xiaoxiong Zhou Yongzheng Wen Xiaomei Yu

作者单位: National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Institute of Microelectr National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Institute of Microelectr

会议类型: 国际会议

会议名称: 第13届国际断裂大会(ICF2013)

会议地点: 北京

会议语种:英文

页码: 1-1

在线出版日期: 2013-06-16（万方平台首次上网日期，不代表论文的发表时间）