Anchor Design for Microdevice Fabricated by Silicon-on-Glass Process Based on Bonding Strength Consideration
In this paper,an array-shaped anchor for microdevice (fabricated by silicon-on-glass (SOG) process) was designed for improving its bonding strength.This design scheme aims to release the coefficient of thermal expansion (CTE) mismatch induced residual stress and decrease the metal electrode layer or particles induced bonding failure risk.To evaluate the bonding performance of the proposed anchor design scheme,numerical simulation and mechanical experiments are carried out on well-established anchor-beam MEMS devices.The scanning electron microscope (SEM) results indicated that the bond yield of the array-shaped anchor was higher than the single anchor.The fracture tests results demonstrated that the torsional bonding strength of the array-shaped anchor was stronger than that of the conventional single anchor in practical application.
Particles Bond yield Torsional bonding strength Fracture test
Jun He Fang Yang Danqi Zhao Xian Huang Wei Wang Dacheng Zhang
National Key Laboratory of Science and Technology on Micro/Nano Fabrication,Institute of Microelectronics,Peking University,Beijing 100871,China
国际会议
北京
英文
1-10
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）