Dynamic Growth of Voids under Effects of Thermal and Vapor Pressure in Electronic Packaging
The failure can be caused in polymers by thermal stress and vapor pressure during reflow process.A profound view on dynamic growth of voids during reflow process is provided in this paper.The mechanical model is analyzed at first.Then the dynamic equation is derived via the energy method.Furthermore,we apply the method to numerically solve the dynamic increase of void volume fraction under the linear-elastic model.Also,the increase proceeding under different Youngs Modulus is compared.It is interesting that the final void volume fraction remain constant when the Youngs Modulus keeps unchanged during the reflow process.At last,the dynamic growth curves on the assumption of super-elastic constitution under different initial void volume fraction are compared.It is notable that the initial void volume fraction is extraordinarily significant for the eventual deformation.
Polymers dynamic growth vapor pressure electronic packaging
Xiaohu Yao Yue Mei Xuejun Fan
School of Civil and Transportation Engineering,South China University of Technology,Guangzhou 510641 Department of Mechanical Engineering,Lamar University,TX 77710,U.S.A
国际会议
北京
英文
1-6
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）