会议专题

On the Dynamic Behaviour of Surface-Bonded Piezoelectric Sensors/Actuators with Partially Debonded Adhesive Layers

  The current work presents the analytical study of the effect of the mechanical and geometrical properties of the adhesive layer on the coupled dynamic electromechanical behaviour of thin piezoceramic sensors/actuators bonded to elastic media.A sensor/actuator model with an imperfect adhesive bonding layer is proposed to simulate the two dimensional electromechanical behaviour of the integrated system.The analytical solution of the problem is provided to study the effect of the bonding layer upon the dynamic behaviour of the sensors/actuators under different loading frequencies.The interfacial debonding and its effect on the interlaminar strain and stress transfer mechanisms are discussed in detail.Numerical results obtained show that even for perfectly bonding cases the dynamic coupling between the sensors/actuators and the host structure is significantly affected by the material and geometric properties of the bonding layer.For imperfect bonding layers,debonding and loading frequency interact strongly to each other at certain frequencies,showing a significant coupling effect.

Piezoelectric Electromechanical Debonding Sensor Actuator

Congrui Jin Lu Han Guoliang Huang Xiaodong Wang

Department of Mechanical Engineering University of Alberta,Edmonton,Canada T6G 2G8

国际会议

第13届国际断裂大会(ICF2013)

北京

英文

1-8

2013-06-16(万方平台首次上网日期,不代表论文的发表时间)