Modelling of molecular bonding with a cohesive zone model strategy
Molecular or direct bonding is an emerging technique to assemble directly two silicon wafers or metal parts.In vaccum,the two surfaces are free to bond perfectly if their lattice orientation is coincident.When defects have to be considered like a misorientation or when bonding is processed in air,a slowdown of the bonding velocity is observed and its efficiency in term of adhesion energy decreased.The aim of this project is to gain insight in the bonding process and to investigate the influence of the bonding characteristics.A specific strategy based on a non linear contact mechanics scheme is adopted to describe the bonding process: the methodology is shown to provide enough flexibility to account for the normal and tangential interactions.These latter are described with Traction-Opening displacement laws that are first derived from interactomic potential.the influence on the bonding characteristic on the bonding wavefront is investigated to attempt deriving local information of the bonding mechanism.
Cohesive model molecular bonding finite element simulation
R. Estevez G Parry P. Mc Garry
Université de Grenoble,SIMaP,UMR CNRS 5266,Grenoble-INP,UJF,1130 rue de la piscine,BP75,F-38402 St M College of Engineering and Informatics,Mechanical and Biomedical Engineering National University of
国际会议
北京
英文
1-6
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）