Crack and defect formation in diamond films
Diamond film Defect Crack Substrate temperature Residual stress
Duosheng Li Qing H.Qin Yi Xiao Dunwen Zuo Wenzhuang Lu
College of Material Science and Engineering,Nanchang Hangkong University,Nanchang 330063,China;Resea Research School of Engineering,Australian national University,Canberra,ACT 2601,Australia College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,
国际会议
北京
英文
1-7
2013-06-16(万方平台首次上网日期,不代表论文的发表时间)