Fracture behavior of thin aluminum films on soft substrate
Thin metal films on soft substrate are conventional in flexible electronics and flexible devices. Thermal stress often exists in the thin metal films due to thermal mismatch during the physical vapor deposition (PVD) process, which leads to the fracture failure of metal films. Theoretical analysis and numerical simulations have predicted that the cracking of a thin stiff layer on a soft substrate depend on the relative stiffness and thickness of the film and the substrate. However, few experimental results reported support the hypothesis. In this paper, An experimental investigation is conducted to study the fracture behavior of the aluminum films on soft Polydimethylsiloxane(PDMS) substrate during physical vapor deposition. It has been found that when the thickness of the aluminum film is relatively smaller, surface wrinkling is induced to accommodate the mismatched strain between the substrate and the film. When the thickness of the aluminum film is relatively larger, cracking of the film occurs.
Aluminum film PDMS substrate PVD process Fracture behavior
Dan Wu, Huimin Xie Yajun Yin
AML,Department of Engineering Mechanics,Tsinghua University,Beijing 100084,China
国际会议
北京
英文
1-6
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）