Towards interface toughness measurement in nanometric films
Thin films deposited on substrates are usually submitted to large residual compression stresses, causing delamination and buckling of the film into various patterns. This phenomenon has been widely investigated in the past few decades, both experimentally and with nonlinear plates models. Nevertheless, the formation of the most commonly observed pattern, the telephone cord blister, has only be understood recently, with FEM models coupling post-buckling studies and mixed-mode adhesion. Here, relying on these models, we show remarkable properties of these wavy blisters, in particular we show that the wavelength of the telephone cord patterns scales linearly with a parameter depending on the stress level in the film, the thickness and the adhesion energy. This result has an important practical application. As a matter of fact, since it is experimentally possible to control the stress level and the film thickness during elaboration, the measurement of this wavelength can indirectly lead to a measurement of the interface toughness, even in very small films.
Buckling Adhesionp Mode mixity Patterning,
Guillaume Parry Jean-Yvon Faou Sergey Grachev Etienne Barthel
SIMAP,Institut National Polytechnique de Grenoble,Domaine Universitaire,1130 Rue de la Piscine,38 40 Surface du Verre et Interfaces,UMR 125 CNRS/Saint-Gobain,39 Quai Lucien Lefranc,F-93303 Aubervillier
国际会议
北京
英文
1-6
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）