The Grinding Mechanism of Nanostructured Ceramic Coatings

摘要：

　　The paper used indentation fracture mechanics model or cutting model to deal with the grinding removal mechanism of nanostructured ceramic coatings,the interaction between the abrasive grains and the workpiece was approximately regarded as ideal small-scale indentation phenomenon,it was used to evaluate the surface quality in ceramic machined processing that formation of grinding crack and its propagation process,the material removed process and the surface defects of the ceramic grinding,the cutting model proved that although the removed material is usually brittle removal,most of the grinding energy consumption was related with plastic deformation.

关键词： Grinding mechanism Nanostructured ceramic coatings Grinding crack Plastic deformation

作者: Weixiang Liu

作者单位: Hunan Institute Of Science And Technology,Yueyang,Hunan,China

会议类型: 国际会议

会议名称: 2013 International Conference on Energy Research and Power Engineering(2013能源研究与电力工程国际会议)(ERPE2013)

会议地点: 郑州

会议语种:英文

页码: 448-451

在线出版日期: 2013-05-24（万方平台首次上网日期，不代表论文的发表时间）