STUDY OF THE HEATING PROFILE TO REDUCE IC DELAMINATION DURING WASTE-PCB DISASSEMBLY
Reuse of electronic components disassembled from waste Printed Circuit Boards (PCBs) is a practical alternative to recycling materials.However,interfacial delamination inside Integrated Circuits (ICs) is easy to occur during the PBC disassembly process and may substantially reduce the reusability.In order to improve the heating process of the PCB disassembly,the effect of heating parameters on IC detamination was investigated through experiment.In this experiment,the ICs were moisture preconditioned,heated with different heating profiles and then inspected using scanning acoustic microscope.In addition,the effect of heating parameters was studied through Finite-Element (FE) simulation using a combined hygro-thermo-mechanical modeling approach.This approach incorporates thermal expansion,hygroscopic swelling and vapor pressure in a single FE model.Based on the experimental and simulation results,a heating profile comprising four stages is proposed aiming to reduce delamination of the disassembled ICs.This heating profile may promisingly give guidance to reuse-oriented disassembly process of waste PCBs.
printed circuit board disassembly integrated circuit reuse delamination
D.F.Long D.Xiang Y.K.Zhang G.H.Duan
Department of Mechanical Engineering, Tsinghua University, Beijing, China
国际会议
杭州
英文
44-51
2013-04-15（万方平台首次上网日期，不代表论文的发表时间）