Novel Emitter-segmented Power HBT with 2-D non-uniform Segment Spacing for High Thermal Stability
With the aid of the thermal model,thermal resistance matrix of emitter-segmented power HBT is proposed to represent thermal effects.The effect of 2-dimensional (2-D) inter-segment spacing on thermal stability of device is studied.It is shown that the increase of inter-segment spacing could effectively decrease thermal coupling resistance,lower temperature of center segments,and hence improves the thermal stability.Furthermore,a novel emitter-segmented power HBT with 2-D non-uniform segment spacing is proposed,in which the non-uniformity of segment temperature is improved by 75.26% and the maximum power level difference of emitter segment is improved by 55.84%,when compared with uniform segment spacing HBT.Therefore the technique of 2-D non-uniform segment spacing is a better method for enhancing the thermal stability of power HBTs.
Power HBTs Thermal resistance matrix Thermal stability
D.Y.Jin R.X.Hu W.R.Zhang D.Lu Q.Fu Y.J.Zhang
College of Electronic Information and Control Engineering,Beijing University of Technology,Beijing 100124,China
国际会议
济南
英文
737-741
2012-12-29(万方平台首次上网日期,不代表论文的发表时间)