Interfacial microstructure of diffusion-bonded Cu/Cu-Ag/Al hybrid alloy
Cu and A16061 alloys were diffusion-bonded at 530℃ with Cu-15 wt.% Ag alloy as an intermediate layer and the interface microstructure were analyzed.The presence of Cu9Al4,CuAl and CuAl2 intermetallic layers were confirmed along with Ag3Mg and AgMg intermetallics.Ag was found to diffuse into Al,forming needle-shaped Ag2Al precipitates in Al substrate close to Al/Cu-Ag interface region.Micro-Vickers indentation aimed at the interface regions,CuAl/CuAl2 and CuAl2/Ag3Mg-AgMg lamella revealed that cracks were formed mostly around the indenter mark in CuAl2 layer more than in CuAl and no cracks in the Ag3Mg-AgMg lamella region,suggesting CuAl2 is more brittle than CuAl and Ag3Mg-AgMg lamella is rather ductile.Ag3Mg-AgMg lamella was found to be formed at the interface between Al and CuAl2.The formation of ductile Ag3Mg-AgMg lamella at the Al interface suggests that the diffusion bonding Cu and Al with Cu-Ag or Ag as a intermediate layer may increases the interface reliability of Cu/Al hybrid alloy.
Cu/Cu-Ag/Al Diffusion bonding Interlayer Microstructure
In Ho Lee Kap Ho Lee Sun Ig Hong
Chungnam National University Daejeon, korea
国际会议
北京
英文
128-132
2012-12-16（万方平台首次上网日期，不代表论文的发表时间）