Mechanical shock ability of different potting materials and packaging processes for electronic components

摘要：

　　In the paper,the mechanical shock abilities of the three potting materials of hard material,silicone and paraffin wax for the ceramic packaging capacitors and metal packaging capacitors are investigated by mechanical shock tests.Results show that the mechanical shock resistance ability of the hard epoxy resin potting material is the strongest,and the mechanical shock resistance ability of the metal packaging component is more than the ceramic packaging.The mechanical shock resistance value of the epoxy resin potting material for metal packaging capacitors is in 20000g above.

关键词： Mechanical shock Potting materials Ceramic packaging Metal packaging

作者: Bo Pan Yong Wang Jingmin Jin Lin Wang Maodong Ma

作者单位: Standardization Institute of China North Industries Group Corporation, China North General electronics Group Limited Corporation of China North Industries Group Corporation,Chin

会议类型: 国际会议

会议名称: 3rd International Conference on Frontiers of Manufacturing and Design Science(第三届制造与设计科学前沿国际会议(ICFMD))

会议地点: 香港

会议语种:英文

页码: 50-54

在线出版日期: 2012-12-11（万方平台首次上网日期，不代表论文的发表时间）