Study on the Influence of Temperature and Stress Field to PCBs Modal

摘要：

　　With the increasing integration of electronic products,the heat flux density is increasing.Research on the heat dissipation of the PCB attracts more attention.Temperature field of the electronic products always changes a lot,usually leading to a transient stress field in the PCB.Due to the transient temperature field and transient stress field,the PCBs modal changed.In this paper,the temperature field and the stress field are obtained to explain the reason of the change.The influence on PCBs modal caused by the temperature field and the stress field are analyzed,on the basis of PCBs thermal modal analysis,which provide a reference for the PCB design and modal analysis in the future.

关键词： temperature field stress field PCBs modal

作者: Qin Luo a Sujuan Zhang Xiao Zhang

作者单位: Beijing University of Aeronautics and Astronautics, Beijing, China

会议类型: 国际会议

会议名称: 3rd International Conference on Frontiers of Manufacturing and Design Science(第三届制造与设计科学前沿国际会议(ICFMD))

会议地点: 香港

会议语种:英文

页码: 1441-1445

在线出版日期: 2012-12-11（万方平台首次上网日期，不代表论文的发表时间）