The design of pin shaping device for IC chips based on recycling
With the rapid development of information and electronic industry,IC chips are widely used in various kinds of electronic products.However,a large number of abandoned IC chips are engendered in the recycling and dismantling process of the electronic products and the mechanical deformations of IC chip pins are inevitably engendered.If the pins of the IC chips are shaped appropriately through proper methods and devices,the IC chips can be reused by refurbishment after being tested.In this paper,the package types of IC chips and the various mechanical deformations of IC chip pins are described.Compared with the existing pin shaping devices,a kind of pin shaping device is developed for IC chips packaged with DIP (Double In-line Package) and SOP (Small Out-Line Package).The various mechanical deformed pins of the abandoned IC chips packaged with DIP and SOP can be shaped correctly by this device which has advantages of wide adapting range,high operating efficiency and high ratio of performance to price.
IC chip recycle pin deformation pin shaping
Y.L.Wang H.Jiang G.F.Liu
School of Mechanical & Automotive Engineering, Hefei University of Technology, Hefei, China
国际会议
香港
英文
280-284
2012-12-01（万方平台首次上网日期，不代表论文的发表时间）