Thermal Analysis of Large Area Organic Light Emitting Diodes
In this paper,thermal evaluation of OLED is carried out by combination of computational fluid dynamic (CFD) based simulation,transient thermal test,and thermal image scanning.Linear relationship between forward voltage and temperature is obtained at sensor current.Electrical power exported from transient thermal test is used as the input power during the thermal simulation to insure same boundary condition.The temperature measured from thermal image scanning is lower than that obtained from the thermal transient test,and the hot spot from numerical calculation is higher than that obtained from the two other approaches.The evaluated OLED panel utilized glass as the substrate and cover.Because of the low thermal conductivity of glass,obvious thermal gradient are expected to exist as we observed from the comparison of thermal transient test and thermal image scanning.The temperature obtained from transient thermal test is the average junction temperature of all the pixels and it is expected to be lower than the hottest spot found in the thermal simulation.In a word,the heat generated in the OLED is much more than can be neglected even if it is area lighting source.Accurate evaluation approach is the precondition to insure the effective thermal management of OLED.
Organic light emitting diode junction temperature transient thermal measurement numerical simulation thermal infrared imager
Lianqiao Yang Meijuan Fu Bin Wei Jianhua Zhang
Key Laboratory of Advanced Display and System Applications(Shanghai University), Ministry of Education, P.O.B 143, 149 Yanchang Rd., Shanghai University, Shanghai 200072, P.R.China
国际会议
9th China International Forum on Solid State Lighting(第九届中国国际半导体照明论坛)
广州
英文
86-88
2012-11-05（万方平台首次上网日期，不代表论文的发表时间）